WebJan 30, 2024 · A bonding base for electronic components, and a method. The bonding base comprises: a dielectric basic layer formed of a mixture comprising thermoplastic polymer, the polymer part of which mixture comprises 75 to 95 % by weight of thermoplastic PPO, the polymer part further comprising 5 to 20 % by weight of elastomer which is incompatible … http://pdf.secdatabase.com/2933/0001047469-02-007506.pdf
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